Mechanical and Cryogenic Plate
The Mechanical & Cryogenic Plate is precisely controllable, providing an open work surface with rapid heating, cooling or holding at temperature, ideal for testing and conditioning thermally conductive devices with a low, flat physical profile such as Radio Frequency (RF) devices and high-density power device testing (e.g. Insulated Gate Bipolar Transistors [IGBTs] and Metal-Oxide-Semiconductor Field-Effect Transistors [MOSFETs]). Compliant with ISO 9001:2008, RoHS, CE, UL61010, the plate add the benefits of fast temperature transitions, a small footprint, easy test access and high heat load absorption.
Physical Specifications
- Surface Area: 7 to 700 sq in (larger sizes available on request)
Performance
- Temperature Range: -100 to 250°C (wide temperature ranges available on request)
- Transition Rates: up to 100°C /min
Key Features
- Hole patterns for fixture compatibility.
- Multiple enclosures for concurrent testing of various Device Under Tests (DUTs).
- Dry air purge option to reduce moisture and prevent frost.
- Independent Fail Safe Module (IFM) protects components from over-temperature conditions.
- Touchscreen operation for remote communications and configuration.
- Serial Ports: Ethernet, Telnet, Web Server (optional: RS232 Serial, IEEE-488 GPIB)
